Environmental sensitive electronic device package and manufacturing method thereof
US9510459B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2013 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Sep 7, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.