Dual gas laser cutting of medical devices
US9511451B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2014 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Mar 6, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system prevents oxidation of a laser cut workpiece by utilizing a laser source that utilizes laser source with an inert gas, such as argon or helium, rather than air or oxygen, to create the slots or kerfs which form the pattern cut into the workpiece. The system introduces oxygen gas through the workpiece as it is being laser cut to oxidize any slag or dross created during the laser cutting process. Oxygen or a mixture of oxygen with other gases cools the slag and the workpiece while at the same time oxidizing the slag to either completely burn or partial burn the slag before it strikes an exposed surface of the tubular member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.