Print head die with thermal control
US9511584B2 · kind B2 · utility
1Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2012 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Sep 25, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14491
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A print head die with thermal control is described. In an example, a print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; a temperature sensor formed on the substrate adjacent to a first one of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent to a last one of the liquid feed slots farthest from the first liquid feed slot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.