Electroplating baths of silver and tin alloys
US9512529B2 · kind B2 · utility
3Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2013 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Mar 31, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.