Electroplating equipment capable of gold-plating on a through hole of a workpiece
US9512533B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2015 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Aug 17, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/004
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The electroplating equipment disposes a hollow first ring between a first mold and a through hole of a workpiece, and a hollow second ring between a second mold and the through hole of the workpiece, such that the first ring and the second ring provide substantially equivalent channel as the openings of the through hole when the first mold and the second mold are set to hold tight the workpiece. The first ring and the second ring, along with an injection channel of the first mold and a recycling channel of the second mold and the through hole of the workpiece, form a seamless flow channel for an electroplating fluid to flow and be electroplated on the wall of the through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.