Non-contact sensing module and method of manufacturing the same
US9513144B2 · kind B2 · utility
1Cited by
7References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 6, 2015 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Nov 6, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A non-contact sensing module includes a coil printed circuit board in which a reference pattern coil may be formed at an upper surface and in which a sensing pattern coil may be formed at a lower surface and that has a mounting hole at the center, and a main printed circuit board that may be coupled to the mounting hole and that may be vertically disposed at an upper surface of the coil printed circuit board and that may be electrically connected to the reference pattern coil and the sensing pattern coil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.