Highly compliant wearable wireless patch having stress-relief capability
US9513666B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2014 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | May 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/183
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wearable patch capable of wireless communications includes an adhesive layer, and a shearable circuit layer comprising a support substrate comprising one or more openings on the adhesive layer, wherein the one or more openings in the support substrate are so positioned to allow the shearable circuit layer to be sheared and elongated, and breathable. A conductive circuit is embedded in the support substrate. One or more semiconductor chips are in connection with the conductive circuit. An elastic layer is positioned on the shearable circuit layer. The one or more semiconductor chips and the conductive circuit can wirelessly communicate with an external device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.