Integrated circuit package
US9514957B2 · kind B2 · utility
0Cited by
1References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2015 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Feb 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method that may include of at least partially surrounding with an insulating encapsulation lead frames, an integrated circuit attachment and wire bonding while preventing the insulating encapsulation from contacting at least one area of a base element; and at least partially surrounding an exterior of the insulating encapsulation with a conductive coating that contacts at least one area of the base element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.