Radio frequency module including segmented conductive top layer
US9515029B2 · kind B2 · utility
12Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2015 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Oct 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A radio frequency (RF) module comprises a conductive top layer configured to improve RF interference-shielding functionality with respect to one or more RF devices disposed on the module. The conductive top layer may be segmented as to form one or more segments of the top layer that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated, top conductive layers correspond to different devices of the module. The top layer may be etched or cut to achieve such segmentation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.