OLED encapsulated in a full-wafer adhesive having a perforated cover
US9515293B2 · kind B2 · utility
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19Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 15, 2012 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Mar 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
Abstract
The invention relates to an organic light-emitting diode (OLED) comprising a stack comprising, in sequence and in the following order, a substrate (2), a first electrode (3), an organic layer (4), and a second electrode (5), characterized in that it comprises a layer of adhesive (6) and a cover (7) fixed onto said stack using said layer of adhesive (6), and the cover (7) comprises at least one through-opening (8), wherein electrical access to an electrode (3, 5) is possible through said opening (8).The present invention can be more specifically used in electronic devices having screens and lighting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.