Radiating sub-terahertz signal from tapered metallic waveguide into dielectric waveguide
US9515367B2 · kind B2 · utility
129Cited by
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4Claims
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Key dates
| Filing date | Nov 12, 2015 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Nov 12, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A metallic waveguide is mounted on a multilayer substrate. The metallic waveguide has an open end formed by a top, bottom and sides configured to receive a core member of a dielectric waveguide, and an opposite tapered end formed by declining the top of the metallic waveguide past the bottom of the metallic waveguide and down to contact the multilayer substrate. A pinnacle of the tapered end is coupled to the ground plane element, and the bottom side of the metallic waveguide is in contact with the multiplayer substrate and coupled to the microstrip line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.