Structures for edge-to-edge coupling with flexible circuitry
US9515402B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2015 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Sep 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/732
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Techniques and mechanisms for coupling a flexible circuit device to another device. In an embodiment, a substrate includes a first side and a second side opposite the first side, where first contacts of a hardware interface are disposed on the first side, and second contacts of the hardware interface are disposed on the second side. First interconnects and second interconnects variously extend in the substrate, where the first contacts are coupled via the first side each to a respective one of the first interconnects, and the second contacts are coupled via the second side each to a respective one of the second interconnects. In another embodiment, the substrate is one of a flexible substrate and a printed circuit board substrate, where the first interface is configured to couple the substrate, in an edge-to-edge configuration, with the other of a flexible substrate and a printed circuit board substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.