Multi-layer transparent structures for electronic device housings
US9516149B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2011 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Feb 21, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Transparent structures for portions of electronic device housings are disclosed. The transparent structures are formed from multiple layers of transparent (optically clear) materials. The multiple layers can include at least an outer glass layer and one or more other transparent layers that can be either glass or polymer layers. The multiple layers can be bonded together with one or more lamination layers. Accordingly, multi-layer transparent structures that are formed from multiple layers bonded together are able to be not only thin but also sufficiently strong and resistant to damage. The multi-layer transparent structures are well suited for use in consumer products, such as consumer electronic devices (e.g., portable electronic devices).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.