Patent · US Active

Micromechanical sensor system combination and a corresponding manufacturing method

US9516424B2 · kind B2 · utility

0Cited by

0References

15Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Christoph Schelling · Stuttgart, DE
Rolf Scheben · Stuttgart, DE
Ricardo Ehrenpfordt · Gerlingen, DE

Key dates

Filing date	Jun 5, 2015
Grant date	Dec 6, 2016
Priority date	—
Expiry date	Jun 5, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH04R31/00
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A micromechanical sensor system combination, and a corresponding manufacturing method, includes an interposer chip including a first front side and a first back side which includes first electrical contacts on the first front side and second electrical contacts on the first back side, the interposer chip having first electrical vias which electrically connect the first electrical contacts to the second electrical contacts; as well as a micromechanical sensor chip system including a second front side a second back side including at least one first sensor device and a second sensor device which are laterally adjacent, the first front side being attached on the second front side so that the first sensor device and the second sensor device are electrically and mechanically connected to the first electrical contacts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.