Wiring substrate and method for manufacturing wiring substrate
US9516753B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2013 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Jan 4, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a wiring substrate includes forming a through-hole penetrating a core layer from one to another surface of the core layer, forming a first metal layer covering the one and the other surface of the core layer and an inner wall surface of the through-hole, forming a second metal layer on the first metal layer, and forming a patterned third metal layer on the second metal layer toward the one surface of the core layer along with forming a patterned fourth metal layer on the second metal layer toward the other surface of the core layer. The forming of the second metal layer includes covering the one and the other surfaces of the core layer and the first metal layer in the through-hole with the second metal layer and closing up a center part of the through-hole with the second metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.