Multilayer structure, fingerprint identification device and manufacturing method thereof
US9516759B2 · kind B2 · utility
0Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2014 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Dec 9, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24752
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer structure comprises an insulation material, a conductive layer and a protective film. The conductive layer is disposed on the insulation material. The protective film is disposed on the surface of the conductive layer, and the surface area of the protective film is less than that of the conductive layer. A fingerprint identification device and a manufacturing method thereof are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.