Sensor over-mold shape
US9517032B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2012 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | Feb 7, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/146
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An implantable sensor module and medical device includes a housing having an inner shell having a thickness extending between an inner wall and an outer wall and an outer layer, wherein the inner shell and the outer layer form a substantially flat portion. A shoulder extends adjacent to a diaphragm to extend the outer layer laterally away from a central medial line extending between edges of the diaphragm. A recess portion is formed between the diaphragm and an inner side of the outer layer, and an over-fill channel is formed by the outer layer extending through the outer layer from an opening formed at the outer wall to an opening formed along the inner side of the outer layer extending along the substantially flat portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.