Patent · US Active

Micromechanical functional apparatus, particularly a loudspeaker apparatus, and appropriate method of manufacture

US9517928B2 · kind B2 · utility

0Cited by

3References

10Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Ricardo Ehrenpfordt · Gerlingen, DE
Mathias Bruendel · Stuttgart, DE
Andre Gerlach · Leonberg, DE
Christina Leinenbach · Ensdorf, DE
Sonja Knies · Rutesheim, DE
Ando Feyh · Palo Alto, US
Ulrike Scholz · Ditzingen, DE

Key dates

Filing date	Oct 12, 2012
Grant date	Dec 13, 2016
Priority date	—
Expiry date	Apr 9, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4913
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate, at least one circuit chip mounted on the substrate, and an enveloping package in which the circuit chip is packaged. The functional apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement having a plurality of micromechanical loudspeakers, which is mounted on the enveloping package. A covering device is mounted above the micromechanical functional arrangement, particularly the loudspeaker arrangement, opposite the enveloping package. A method is implemented to manufacture the micromechanical functional apparatus.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.