LED module
US9518726B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2014 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | Oct 8, 2034 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED module includes an LED, a printed circuit board (PCB), a lens, a lens mask and a heat dissipation component; the heat dissipation component includes an aluminum-made heat dissipation frame, a heat-conducting fin, a connection assembly part and a plurality of heat dissipation plates, the aluminum-made heat dissipation frame is provided with a plurality of heat dissipation plate mounting holes that are arranged in parallel, the heat dissipation plates are amounted in the heat dissipation plate mounting holes on the aluminum-made heat dissipation frame in an insertion mode, the PCB is fixed on a bottom surface of the aluminum-made heat dissipation frame, and the heat-conducting fin is located between the PCB and the heat dissipation plates on the aluminum-made heat dissipation frame; and the aluminum-made heat dissipation frame is provide with a wire-threading position, and a location of the wire-threading position is between a corresponding electrical interface and a corresponding power-on interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.