Integrated structure with improved heat dissipation
US9520334B2 · kind B2 · utility
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1References
27Claims
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Key dates
| Filing date | Jan 14, 2014 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | Jun 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06589
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion compatible with the chip. The housing may further including closed cavities filled with a phase change material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.