Semiconductor device
US9521758B2 · kind B2 · utility
1Cited by
1References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 19, 2014 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | Jun 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor module that has an electrode terminal projecting externally; a substrate that has a through hole or a cut-out for inserting the electrode terminal; and a guide member that is provided between the semiconductor module and the substrate and guides the electrode terminal in such a manner that the electrode terminal is inserted into the through hole or the cut-out. The guide member becomes out of contact with the electrode terminal after the electrode terminal is inserted into the through hole or the cut-out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.