Rigid flexible printed circuit board and method of manufacturing the same
US9521760B2 · kind B2 · utility
0Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2014 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | May 20, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.