Electronic component mounting method
US9521792B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2011 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | Sep 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an electronic component mounting method, electronic components are picked up from a component supply unit in which two tray supply mechanisms are arranged, and mounted on substrates. In the method, both of the tray supply mechanisms are allowed to hold trays storing therein the electronic components to be mounted on the substrates. If shortage of the components occurs in one tray supply mechanism during a component mounting process, a target for picking up the electronic components is switched to the other tray supply mechanism. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.