Apparatus and method for depositing thin film
US9522410B2 · kind B2 · utility
0Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2013 |
| Grant date | Dec 20, 2016 |
| Priority date | — |
| Expiry date | Jan 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/164
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin film deposition apparatus includes a substrate supporting unit supporting a substrate, a deposition source evaporating a deposition material to supply a steam of the deposition material to the substrate, and a deposition source shifting unit moving the deposition source so that the deposition source is relatively shifted with respect to the substrate supporting unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.