Primer compositions for adhesive bonding systems and coatings
US9522974B2 · kind B2 · utility
3Cited by
31References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2010 |
| Grant date | Dec 20, 2016 |
| Priority date | — |
| Expiry date | Feb 13, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to aqueous-based primer composition, comprising at least one thermosetting, self-emulsifying epoxy resin composition; at least one thermosetting, non-self-emulsifying resin composition; water; and at least one curative.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.