Radiation-sensitive resin composition, resist pattern-forming method, acid generator and compound
US9523911B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2014 |
| Grant date | Dec 20, 2016 |
| Priority date | — |
| Expiry date | May 20, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07C2603/74
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a radiation-sensitive resin composition that contains a polymer having a structural unit that includes an acid-labile group; and an acid generator, wherein the acid generator includes a compound including a sulfonate anion having SO3−, wherein a hydrogen atom or an electron-donating group bonds to an α carbon atom with respect to SO3−, and an electron-withdrawing group bonds to a β carbon atom with respect to SO3−; and a radiation-degradable onium cation. The compound preferably has a group represented by the following formula (1-1) or (1-2). In the following formulae (1-1) and (1-2), R1 and R2 each independently represent a hydrogen atom or a monovalent electron-donating group. R3 represent a monovalent electron-withdrawing group. R4 represents a hydrogen atom or a monovalent hydrocarbon group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.