Earphone and fabrication method thereof
US9525927B2 · kind B2 · utility
1Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2012 |
| Grant date | Dec 20, 2016 |
| Priority date | — |
| Expiry date | Mar 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosure provides an earphone and a fabrication method thereof. The earphone includes: an earphone wire, wherein the earphone wire includes flexible wire parts and hard wire parts which are arranged alternately. The technical scheme provided in the disclosure solves the problem existing in the related technologies that earphone wires entwine easily and cannot be untangled readily and therefore effectively avoids the entwining of earphone wires and improves user experience.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.