Electronic module for a piece of vehicle-borne aeronautic equipment and a piece of aeronautic equipment for an aeronautic vehicle
US9526170B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2013 |
| Grant date | Dec 20, 2016 |
| Priority date | — |
| Expiry date | Jan 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronics module for use at high temperature (up to 225° C.) in onboard aviation equipment, the module having a thick layer hybrid circuit covered in a sealing coating of poly-p-xylylene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.