Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module
US9526191B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2014 |
| Grant date | Dec 20, 2016 |
| Priority date | — |
| Expiry date | Aug 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fluid cooled enclosure includes a fluid conduit that provides a fluid coolant path between sides of a housing. Optionally, the fluid conduit can provide bi-directional fluid coolant paths. In another example, an interface block can be provided with a first interface surface engaging an interface surface of a first end portion of the fluid conduit. In another example, a first end portion of the fluid conduit is fabricated with a first material composition and the interface block is fabricated with a second material composition that has a higher thermal conductivity than the first material composition. In further examples, methods of cooling a conduction cooled circuit module comprise the steps of mounting an interface block to a conduction cooled circuit module, mounting the interface block with respect to the fluid conduit, and cooling the electrical circuits of the conduction cooled circuit module by flowing fluid coolant through the fluid conduit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.