Wave soldering apparatus and nozzle thereof
US9527151B2 · kind B2 · utility
0Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2014 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Jul 29, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus used for wave soldering including a nozzle device configured to discharge molten solder to a circuit board near a solder tank, wherein, the nozzle device includes at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.