High throughput laser processing
US9527164B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Sep 19, 2014 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Oct 29, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/547
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.