Heat pump apparatus
US9528732B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2013 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Jan 6, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/52
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump apparatus is provided. The heat pump raises the water temperature during a hot-water supply without using a separate heat source such as a heater. The heat pump apparatus includes an outdoor unit including a first compressor, a first heat exchanger, and a first expansion valve. The heat pump apparatus includes an indoor unit including a second heat exchanger and a second expansion valve, a hydro unit including a second compressor, a third heat exchanger, a fourth heat exchanger, a fifth heat exchanger, a third expansion valve, a fourth expansion valve, and a fifth expansion valve. The heat pump apparatus includes a refrigerant flow path switching unit to switch among flow paths, and a water flow path switching unit to switch between flow paths of the water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.