Surfacing algorithm for designing and manufacturing 3D models
US9529939B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2011 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Nov 4, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T17/205
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Techniques are described for decomposing three-dimensional (3D) geometry into an assemblable collection of two-dimensional (2D) panels. Importantly, the 3D geometry is automatically encoded into the 2D panels, allowing the 3D geometry to be recreated simply by joining the 2D panels at the appropriate seams and creating the appropriate bends/folds in each panel. Further, each panel has edges, vertices, and faces which can be encoded in the panelization, allowing assembly instructions to be algorithmically generated, Doing so allows users to be provided with a step-by-step instructions carried out to realize the 3D geometry encoded in the 2D panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.