Encapsulated simulation components
US9530019B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2015 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Jul 13, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods are provided for providing protected three-dimensional components for simulation. A three-dimensional component may be accessed, wherein the three-dimensional component includes one or more characteristics of the three-dimensional component, and wherein certain values of the characteristics of the three-dimensional components are variable via a parameter. An encapsulation command may be received for the three-dimensional component, wherein the encapsulation command includes an encryption setting, an access control setting, and an identification of which values of the characteristics of the three-dimensional component are variable via a parameter. An encapsulation of the three-dimensional component may be generated, wherein the encapsulation is encrypted based on the encryption setting and the access control setting, and wherein, when the three-dimensional component is encrypted, the three-dimensional component is inaccessible outside of an authorized program.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.