Patent · US Active

Method for the plasma coating of a substrate, in particular a press platen

US9530624B2 · kind B2 · utility

1Cited by

8References

11Claims

0Family size

Assignee

Berndorf Hueck Band- und Pressblechtechnik GmbH · AT

Inventors

Andreas Gebeshuber · Neuzeug, AT
Daniel Heim · Wels, AT
Johann Laimer · Baden, AT
Thomas G. Mueller · Wolfsburg, DE
Michael Proschek · Mayrhofen, AT
Otto Stadler · Berndorf, AT
Herbert Stoeri · Wien, AT

Key dates

Filing date	Aug 6, 2013
Grant date	Dec 27, 2016
Priority date	—
Expiry date	Aug 6, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/32577
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

An apparatus for the plasma coating of a substrate, in particular a press platen, is provided and is used to perform a method to plasma coat the press platen. The apparatus includes a vacuum chamber and, arranged therein, an electrode, which is segmented. Each of the electrode segments has a dedicated connection for an electrical source. Also provided is the method for operating the apparatus. According to the method, a substrate to be coated is positioned opposite the electrode and at least one energy source that is assigned to an electrode segment is activated. Moreover, a gas is introduced, with the effect of bringing about plasma-enhanced chemical vapor deposition on the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.