Die bonder and bonding method
US9530751B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2015 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Apr 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die bonder and a bonding method are provided that are capable of surely mounting a die on an intermediate stage and surely picking up the die from the intermediate stage and thus, are high in reliability. The die bonder is provided with the intermediate stage for mounting thereon the die picked up by the pickup head from a die supply unit. A mounting portion of the intermediate stage is provided with an uneven pattern including a plurality of mounting support protrusions having contact surfaces that flush contact the back surface of the die for supporting the die not to slip out of place, and a plurality of recesses formed between the mounting support protrusions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.