Three-dimensional patterning methods and related devices
US9530912B2 · kind B2 · utility
3Cited by
21References
21Claims
0Family size
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Key dates
| Filing date | Nov 30, 2010 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Mar 13, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
Three-dimensional patterning methods of a three-dimensional microstructure, such as a semiconductor wire array, are described, in conjunction with etching and/or deposition steps to pattern the three-dimensional microstructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.