Sintering method and display device packaging method using the same
US9530983B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2015 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Jan 22, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C17/04
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A sintering method includes defining a closed pattern having at least one arcuate section. A substance is applied on a substrate along the closed pattern and is sintered along the closed pattern in a first rectilinear direction. The sintering is finished in a second rectilinear direction along the closed pattern. A display device packaging method includes defining a closed pattern having at least one arcuate section. Frit is applied on a substrate of a display device along the closed pattern. A cover plate is provided on the substrate. The frit is sintered along the closed pattern. The sintering is finished in a second rectilinear direction. Then, the cover plate and the substrate of the display device are packaged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.