Debonders with a recess and a heater for semiconductor fabrication
US9533484B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2016 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Feb 19, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1978
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first surface of a debonder defines a recess to hold an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The carrier plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the carrier plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface, where the second surface includes suction openings that deliver a suction force to the recess, and a portion of the second surface is in contact with a heat source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.