CMOS ultrasonic transducers and related apparatus and methods
US9533873B2 · kind B2 · utility
51Cited by
99References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2014 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Feb 5, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0771
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.