Method for forming dense silicic film
US9534145B2 · kind B2 · utility
1Cited by
0References
19Claims
0Family size
Inventors
Key dates
| Filing date | Oct 9, 2013 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Oct 9, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2483/16
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a dense silicic film and a producing method thereof. This method comprises coating a composition for coating film, which comprises a polymer having a silazane bond on a substrate, on a substrate, irradiating with light having a maximal peak in the range of 160-179 nm wavelength, and then irradiating with light having 10-70 nm wavelength longer maximal peak wavelength than the light used in the previous irradiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.