Adhesion promotion to difficult substrates for hot melt adhesives
US9534155B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2015 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Feb 19, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J123/0853
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Hot melt adhesive compositions which have enhanced adhesion to difficult substrates, particularly at refrigerator/freezer temperatures or at elevated temperatures. The inventive compositions require a base polymer comprising an ethylene vinyl acetate-containing polymer; a tackifier; an adhesion promoting additive comprising at least one semi-crystalline polymer having a weight average molecular weight of about 30,000 daltons or less; and optional wax; and an optional antioxidant. It has been found that the adhesion promoting additive of this invention enhances the adhesion properties of a hot melt adhesive composition having ethylene vinyl acetate-containing polymer, particularly at elevated temperatures or at low refrigerator and freezer temperatures where other conventional adhesives have been unsuccessful.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.