Patent · US Active

Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device

US9534310B2 · kind B2 · utility

1Cited by

9References

16Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Ralph Rauenbusch · Berlin, DE
Christian Thomas · Walldorf, DE
Ray Weinhold · Berlin, DE
Heinz Klingl · Neuss, DE

Key dates

Filing date	Dec 3, 2013
Grant date	Jan 3, 2017
Priority date	—
Expiry date	Dec 3, 2033

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D7/123
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate, a container suitable for receiving such a device and a substrate holder, which is suitable for receiving a substrate to be treated, and the use of such a device inside of such a container for galvanic metal, in particular copper, deposition on a substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.