Light-emitting diode assembly and fabrication method thereof
US9534747B2 · kind B2 · utility
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2References
10Claims
0Family size
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Key dates
| Filing date | Oct 3, 2014 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Oct 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed embodiments include a manufacturing method for an LED assembly. Providing a first carrier, wherein several LED chips are formed on the first carrier, and providing a second carrier. Attaching the second carrier to the LED chips and detaching the first carrier from the LED chips but leaving the LED chips on the second carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.