Patent · US Active

Thermal-mechanical testing apparatus for electrically conductive specimen testing systems and method for use thereof

US9535078B2 · kind B2 · utility

3Cited by
9References
18Claims
0Family size

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Inventor

Key dates

Filing dateNov 18, 2013
Grant dateJan 3, 2017
Priority date
Expiry dateFeb 22, 2035

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N2203/0246
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A thermal-mechanical testing apparatus for use with an electrically conductive specimen testing system. In one embodiment, the apparatus includes a first compression anvil assembly, a mounting frame coupled to the first compression anvil assembly, and a second compression anvil assembly positioned opposite the first compression anvil assembly and the mounting frame. The first compression anvil assembly includes a mounting plate, a first compression anvil coupled to the mounting plate, and a heating current ground system coupled to the mounting plate. The mounting frame includes a set of conductive end plates, a set of insulating connectors connecting the conductive end plates, and a plurality of mounting components coupled to the insulating connectors. The mounting components are also coupled to the mounting plate. The second compression anvil assembly includes a conductive mounting plate, a second compression anvil coupled to the conductive mounting plate, and a heating current by-pass system coupled to the conductive mounting plate and one of the conductive end plates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.