Electronic substrate with heat dissipation structure
US9535470B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 2, 2014 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Jan 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0203
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic substrate with heat dissipation structure includes a substrate plate and at least one heat pipe. The substrate plate includes a wiring layer, a grounding layer and an insulation layer from top to bottom. The wiring layer has at least one heat-producing element mounted thereon, and is formed with a receiving hole for the heat pipe to tightly fit therein. Heat produced by the heat-producing element and distributed over a high-temperature zone of the substrate plate surrounding the heat-producing element is absorbed by the heat pipe and then transferred to a low-temperature zone of the substrate plate distant from the heat-producing element, from where the heat is dissipated into ambient air to achieve cooling effect at upgraded heat dissipation efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.