Semiconductor package with conformal EM shielding structure and manufacturing method of same
US9536841B2 · kind B2 · utility
2Cited by
0References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 31, 2015 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Jul 31, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a substrate having a front side, a bottom side, and a sidewall along a perimeter of the substrate, a plurality of solder pads on the bottom side, at least one EM shielding contact structure on the bottom side and partially exposed on the sidewall, a semiconductor device mounted on the front side, a mold compound on the front side and covering the semiconductor device, and an EM shielding layer conformally covering the mold compound and the sidewall. The EM shielding layer is in direct contact with the exposed portion of the EM shielding contact structure on the sidewall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.