Non-ablative laser patterning
US9537042B2 · kind B2 · utility
22Cited by
7References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 18, 2013 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Mar 1, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for processing a transparent substrate includes generating at least one laser pulse having laser parameters selected for non-ablatively changing a conductive layer disposed on the transparent substrate into a non-conductive feature, and directing the pulse to said conductive layer. A protective film may be affixed to a surface of the transparent substrate and need not be removed during the processing of the substrate. After processing, processed areas can be visually indistinguishable from unprocessed areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.