Optoelectronic component with a wireless contacting
US9537070B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2005 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Jan 17, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8516
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic component contains a semiconductor chip (1) and a carrier body (10), which are provided with a transparent, electrically insulating encapsulation layer (3), the encapsulation layer (3) having two cutouts (11, 12) for uncovering a contact area (6) and a connection region (8) of the carrier body, and an electrically conductive layer (14) being led from the contact area (6) over a partial region of the encapsulation layer (3) to the electrical connection region (8) of the carrier body (10) in order to electrically connect the contact area (6) and the electrical connection region (8) to one another. The radiation emitted in a main radiation direction (13) by the semiconductor chip (1) is coupled out through the encapsulation layer (3), which advantageously contains luminescence conversion substances for the wavelength conversion of the emitted radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.