Wiring board and method for manufacturing the same
US9538642B2 · kind B2 · utility
2Cited by
0References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 10, 2014 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Mar 10, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board includes a core structure including a core substrate, and a buildup structure formed on the core structure and including an interlayer insulating layer and a conductive layer. The interlayer insulating layer does not contain inorganic fiber and includes a resin and an inorganic filler, and the conductive layer is formed on the interlayer insulating layer such that the inorganic filler in the interlayer insulating layer is not in contact with the conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.